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Breaking Device - List of Manufacturers, Suppliers, Companies and Products

Breaking Device Product List

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Breaking Device "AMC-7600"

Breaking Device "AMC-7600"

Achieving a scribing accuracy of ±15μm!

The "AMC-7600" is a breaking device that uses tungsten carbide rollers to easily create high-precision cross-sectional samples for SEM observation. It adopts a high-precision scribing mechanism and a skip scribing mechanism, allowing for the acquisition of beautifully fractured surfaces in a short time. This product meets the needs of customers who want to easily create cross-sectional SEM samples. 【Features】 ■ Easy operation ■ Short time ■ No polishing ■ Completely dry cut ■ Low running cost *For more details, please refer to the catalog or feel free to contact us.

  • Crusher
  • Other physicochemical equipment

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Breaking Device "AMC-7800"

Breaking Device "AMC-7800"

Significantly improve work efficiency!

The "AMC-7800" is a breaking device designed to create cross-sectional samples for SEM observation of materials such as mask glass, silicon, SiC, liquid crystal substrates, and sapphire substrates. The operation is simple, requiring only five steps, and allows for the production of observation samples with beautiful fracture surfaces in a short amount of time. Additionally, it significantly improves work efficiency. 【Features】 ■ No polishing ■ Completely dry cutting ■ High-precision scribing mechanism ■ Skip scribing mechanism ■ Low running costs *For more details, please refer to the catalog or feel free to contact us.

  • Crusher
  • Other physicochemical equipment

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Breaking Device "AMC-8000"

Breaking Device "AMC-8000"

Achieving a scribing accuracy of ±2.5μm!

The "AMC-8000" is a breaking device that produces unpolished, short-time cross-sectional observation samples of various semiconductor plates such as silicon and GaAs, as well as glass materials like LCD substrates and masks. It employs a scribing process using a roller cutter combined with a dedicated breaking system, achieving unpolished and completely dry cuts. Air suction is not required, and the utility needed is only a 100V power supply. 【Features】 ■ Easy operation ■ Adoption of breaking system ■ High-precision cross-sectional sample production ■ No air suction required ■ Compatible with 100V utility *For more details, please refer to the catalog or feel free to contact us.

  • Crusher
  • Other physicochemical equipment

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High-performance wafer and mask breaking device "AMC Series"

High-performance wafer and mask breaking device "AMC Series"

Easily create cross-sectional observation samples for SEM! Marking is possible with a positional accuracy of ±2.5μm.

The high-performance wafer and mask breaking device "AMC Series" is designed to easily create cross-sectional samples for SEM observation using tungsten carbide rollers. The processing process involves teaching the scribing position while watching the monitor, and automatically starting the scribing. The observation section is automatically skipped, and the internal stress from the scribing is utilized to break the sample. The samples are cut out to be insertable into electron microscope sample holders, etc. The "AMC Series" allows for the quick and precise creation of cross-sectional samples. 【Features】 ■ Scribing with a minimum positional accuracy of ±2.5μm is possible ■ A breaking method utilizing the stress from scribing is adopted ■ Samples with clean cross-sections can be produced ■ Continuous setting of scribing pressure ■ Scribing is possible at a constant pressure even for curved samples *For more details, please refer to the PDF document or feel free to contact us.

  • Semiconductor inspection/test equipment
  • Microscope
  • Other processing machines

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